When Great Powers Talk, Who Speaks for Asia 
About the China Capital investigation 
Frequently asked questions about the China Capital investigation 
Artificial intelligence (AI) is driving unprecedented demand for computing, placing photonic chips at the centre of the race to develop next-generation AI hardware.
By transmitting data with light rather than electricity, photonic technologies are widely seen as a way to overcome bandwidth and power constraints.
However, translating that potential into mass-producible hardware is often bottlenecked by slow, complex manufacturing.
A Chinese research team says it has overcome one of the field’s biggest manufacturing hurdles, unveiling a fabrication method that cuts production time for complex three-dimensional optical structures from hours to seconds.
Published in a peer-reviewed top journal Advanced Materials on July 4, the study was led by scientists from the Institute of Physics under the Chinese Academy of Sciences (CAS), together with collaborators from the University of Hong Kong and several other Chinese institutions.
“Our work establishes a versatile platform that bridges the gap between design complexity and scalable manufacturing for next-generation 3D integrated photonics,” wrote the research team led by PhD student Wang Yi.
Don't Miss:
-
China urges ‘constructive dialogue’ with EU in high-level call with France
-
Hong Kong airport builds third runway with strategy to help marine environment thrive
-
Cambodia, Thailand take US$300 billion seabed dispute to UN
-
Hong Kong visitor arrivals hit post-pandemic monthly high in August
-
Indonesian finance minister found out about his firing in mid-meeting phone call